bipolar analog integrated circuit pc4072 j-fet input low-noise dual operational amplifier data sheet document no. g15205ej5v0ds00 (5th edition) date published marh 2004 n cp(k) printed in japan the mark shows major revised points. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. 1987 description the pc4072 is a j-fet input operational amplifier. this product is designed as low noise version of the pc4082. the features of the pc4072 are more improved input equivalent noise voltage, input offset voltage and input bias current than those of pc4082. by these features, the pc4072 is excellent choice for wide variety of applications including audio preamplifier and active filter. features ? low noise: e n = 17 nv/ hz (typ.) ? very low input bias and offset currents ? output short circuit protection ? high input impedance...j-fet input stage ? internal frequency compensation ? high slew rate...13 v/ s (typ.) ordering information part number package pc4072c 8-pin plastic dip (7.62 mm (300)) pc4072g2 8-pin plastic sop (5.72 mm (225)) pc4072ha 9-pin plastic slim sip equivalent circuit (1/2 circuit) pin configuration (top view) pc4072c, 4072g2 1 1 2 3 4 8 7 6 5 v + out 2 i i2 i n2 + ? 2 out 1 i i1 i n1 v ? + ? pc4072ha 123456789 1 + ? 2 v + out 1 i i1 i n1 v ? i n2 i i2 out 2 v + + ? r 1 r 8 r 9 r 6 d 1 r 7 r 10 r 11 d 2 q 15 r 4 r 2 r 5 r 3 i i i n q 1 q 2 q 8 q 16 q 9 q 10 q 12 q 13 q 5 q 14 q 3 q 4 q 11 q 6 q 7 c 1 out v ? v +
data sheet g15205ej5v0ds 2 pc4072 absolute maximum ratings (t a = 25c) parameter symbol ratings unit voltage between v + and v ? note 1 v + ? v ? ?0.3 to +36 v differential input voltage v id 30 v input voltage note 2 v i v ? ?0.3 to v + +0.3 v output voltage note 3 v o v ? ?0.3 to v + +0.3 v c package note 4 350 mw g2 package note 5 440 mw power dissipation ha package note 4 p t 350 mw output short circuit duration note 6 indefinite sec operating ambient temperature t a ?20 to +80 c storage temperature t stg ?55 to +125 c notes 1. reverse connection of supply voltage can cause destruction. 2. the input voltage should be allowed to input without damage or destruction. even during the transition period of supply voltage, power on/off etc., this s pecification should be kept. the normal operation will establish when the both inputs are within the common mode input voltage range of electrical characteristics. 3. this specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. even during the transition period of supply voltage, power on/off etc., this specification should be kept. the output voltage of normal operation will be the output voltage swing of electrical characteristics. 4. thermal derating factor is ?5.0 mv/c when oper ating ambient temperature is higher than 55c. 5. thermal derating factor is ?4.4 mv/c when oper ating ambient temperature is higher than 25c. 6. pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, note 4 and note 5. recommended operating conditions parameter symbol min. typ. max. unit supply voltage v 5 16 v output current i o 10 ma capacitive load (a v = +1, r f = 0 ? ) c l 100 pf
data sheet g15205ej5v0ds 3 pc4072 electrical characteristics (t a = 25c, v = 15 v) parameter symbol conditions min. typ. max. unit input offset voltage v io r s 50 ? 3 10 mv input offset current note 7 i io 5 50 pa input bias current note 7 i b 30 200 pa large signal voltage gain a v r l 2 k ? , v o = 10 v 25000 200000 supply current note 8 i cc i o = 0 a 4 5 ma common mode rejection ratio cmr 70 86 db supply voltage rejection ratio svr 70 86 db r l 10 k ? 12 13.5 v output voltage swing v om r l 2 k ? 10 12 v common model input voltage range v icm 10 v slew rate sr a v = 1 13 v/ s unity gain frequency f unity 3 mhz input equivalent noise voltage v n r s = 100 ? , f = 10 hz to 10 khz 4 v r.m.s. input equivalent noise voltage density e n r s = 100 ? , f = 1 khz 17 nv/ hz channel separation 120 db input offset voltage v io r s 50 ? , t a = ?20 to +70c 1 3 mv average v io temperature drift ? v io / ? t t a = ?20 to +70c 10 v/c input offset current note 7 i io t a = ?20 to +70c 2 na input bias current note 7 i b t a = ?20 to +70c 7 na notes 7. input bias currents flow into ic. because each curr ents are gate leak current of p-channel j-fet on input stage. and that are temperature sensitive. short time measuring method is recommendable to maintain the junction temperature close to the operating ambient temperature. 8. this current flows irrespective of the existence of use.
data sheet g15205ej5v0ds 4 pc4072 typical performance characteristics (t a = 25c, typ.) 20 600 500 400 300 200 100 0 ? 5 ? 4 ? 3 ? 2 ? 1 0 0.01 0.1 1.0 10 100 1 2 3 4 5 0 20 40 60 80 100 120 10 20 ? 40 ? 20 0 20 t a - operating ambient temperature - c input offset voltage input bias current t a - operating ambient temperature - c 40 60 80 1 ? 200 20406080 100 10 k 1 m 1 k 10 100 k 10 m 40 60 80 100 r l = 10 k ? pc4072g2 pc4072c, 4072ha t a - operating ambient temperature - c v - supply voltage - v large signal frequency response output voltage swing f - frequency - hz power dissipation open loop frequency response p t - total power dissipation - mw v io - input offset voltage - mv a v - open loop voltage gain - db v om - output voltage swing - v p-p i b - input bias current - na v = 15 v r l = 2 k ? v = 15 v v = 15 v 200 c/w 227 c/w 40 0 30 20 10 0 10 20 30 100 1 k 10 k 100 k 1 m 10 m f - frequency - hz v om - output voltage swing - v p-p v= 15 v r l = 10 k ? v= 10 v v= 5 v each 5 samples data
data sheet g15205ej5v0ds 5 pc4072 v o - output voltage - v voltage follower pulse response t - time - s 0 ? 5 0 5 1 23 voltage density - nv/ hz e n - input equivalent noise input equivalent noise voltage density f - frequency - hz 10 10 10 10 10 1 100 1 k 10 k 100 k output voltage swing r l - load resistance - ? 0 300 1 k 10 k 10 20 30 r s = 100 ? v = 15 v v = 15 v a v = + 1 r l = 2 k ? c l = 100 pf v = 15 v 4 v i - input voltage - v / ? 5 0 5 100 3 k v om - output voltage swing - v p-p i cc - supply current - ma supply current v - supply voltage - v 5 0 0.5 1.0 1.5 2.0 2.5 10 15 20 4 3 2
data sheet g15205ej5v0ds 6 pc4072 package drawings (unit : mm) 14 85 item millimeters notes 1. each lead centerline is located within 0.25 mm of its true position (t.p.) at maximum material condition. p8c-100-300b,c-2 n 0.25 p 0.9 min. r0 15 a 10.16 max. b 1.27 max. f 1.4 min. g 3.2 0.3 j 5.08 max. k 7.62 (t.p.) c 2.54 (t.p.) d 0.50 0.10 h 0.51 min. i 4.31 max. l 6.4 m 0.25 + 0.10 ? 0.05 2. ltem "k" to center of leads when formed parallel. m a r m p i j h g f dn c b 8-pin plastic dip (7.62mm(300)) l k
data sheet g15205ej5v0ds 7 pc4072 item b c i 8-pin plastic sop (5.72 mm (225)) d e f g h j p millimeters 1.27 (t.p.) 0.78 max. 4.4 0.15 0.1 0.1 0.42 1.59 0.21 6.5 0.3 1.49 + 0.08 ? 0.07 1.1 0.2 3 + 7 ? 3 note each lead centerline is located within 0.12 mm of its true position (t.p.) at maximum material condition. a 5.2 + 0.17 ? 0.20 k l m n 0.6 0.2 0.17 0.12 0.10 + 0.08 ? 0.07 s8gm-50-225b-6 85 1 4 s m c detail of lead end a m s n f g b e d p h i j k l
data sheet g15205ej5v0ds 8 pc4072 19 m 9-pin plastic slim sip item millimeters a 22.86 max. 1.1 min. h m n g 2.54 j 1.27 max. f c 0.5 0.1 0.25 k 0.51 min. q 5.75 max. u 1.5 max. 5.08 max. 2.8 0.2 y 3.2 0.5 z 1.1 min. m q y h a k j c f g z n u v note each lead centerline is located within 0.25 mm of its true position (t.p.) at maximum material condition. p9ha-254b-2 v 0.25 + 0.10 ? 0.05
data sheet g15205ej5v0ds 9 pc4072 recommended soldering conditions the pc4072 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http://www.necel.com/pkg/en/mount/index.html) type of surface mount device pc4072g2: 8-pin plastic sop (5.72 mm (225)) process conditions symbol infrared ray reflow peak temperature: 230c or below (package surface temperature), reflow time: 30 seconds or less (at 210c or higher), maximum number of reflow processes: 1 time. ir30-00-1 vapor phase soldering peak temperature: 215c or below (package surface temperature), reflow time: 40 seconds or less (at 200c or higher), maximum number of reflow processes: 1 time. vp15-00-1 wave soldering solder temperature: 260c or below, flow time: 10 seconds or less, maximum number of flow processes: 1 time, pre-heating temperature: 120c or below (package surface temperature). ws60-00-1 partial heating method pin temperature: 300c or below, heat time: 3 seconds or less (per each side of the device). ? caution apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. type of through-hole device pc4072c: 8-pin plastic dip (7.62 mm (300)) pc4072ha: 9-pin plastic slim sip process conditions wave soldering (only to leads) solder temperature: 260c or below, flow time: 10 seconds or less. partial heating method pin temperature: 300c or below, heat time: 3 seconds or less (per each lead). caution for through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.
pc4072 the information in this document is current as of march, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1
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